Die Bonder is a key equipment used in the semiconductor packaging process, whose main function is to firmly connect the electrical connection points (solder joints) between the chip (wafer) and the packaging substrate to achieve electrical connection and physical support. Die bonding machines play an important role in semiconductor packaging processes. The following is an introduction to die bonding machines and a brief explanation of key process technologies:

Die bonder, also known as surface mount machine, is the most critical and core equipment in the die attach process of chip packaging and testing. Grab the chip from the already cut wafer and place it on the corresponding Die flag of the substrate. Use silver glue (Epoxy) to bond the chip and substrate together. The surface mount machine can place electronic components at high speed and precision, and achieve key steps such as positioning, alignment, inversion, and continuous mounting.